Invention Grant
- Patent Title: Fiber optic sensor manufacturing method and structure thereof
- Patent Title (中): 光纤传感器的制造方法及其结构
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Application No.: US13917693Application Date: 2013-06-14
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Publication No.: US09194991B2Publication Date: 2015-11-24
- Inventor: Chia-Chin Chiang , Kuang-Chuan Liu
- Applicant: Chia-Chin Chiang , Kuang-Chuan Liu
- Applicant Address: TW Kaohsiung
- Assignee: National Kaohsiung University of Applied Sciences
- Current Assignee: National Kaohsiung University of Applied Sciences
- Current Assignee Address: TW Kaohsiung
- Agency: Kamrath IP Lawfirm, P.A.
- Agent Alan D. Kamrath
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/00 ; G01D5/353 ; G01K1/14 ; G01K11/32 ; G01L1/24 ; G02B6/34
Abstract:
A fiber optic sensor structure includes a first substrate, a second substrate, a third substrate, a first fiber optic sensor and a second fiber optic sensor. The first substrate has a first groove, while the second substrate has a second groove. A manufacturing method includes: arranging the first fiber optic sensor in the first groove and arranging the second fiber optic sensor the second groove; and stacking the second substrate on the first substrate and stacking the third substrate on the second substrate. When assembled, the first fiber optic sensor is provided between the first substrate and the second substrate, and the second fiber optic sensor is provided between the second substrate and the third substrate to form a double-layer fiber optic sensor.
Public/Granted literature
- US20140369641A1 Fiber Optic Sensor Manufacturing Method and Structure Thereof Public/Granted day:2014-12-18
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