Invention Grant
- Patent Title: Integrated circuit and manufacturing method
- Patent Title (中): 集成电路及制造方法
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Application No.: US14147214Application Date: 2014-01-03
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Publication No.: US09188540B2Publication Date: 2015-11-17
- Inventor: Aurelie Humbert , Roel Daamen , Youri Victorovitch Ponomarev
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP13150418 20130107
- Main IPC: H01L31/02
- IPC: H01L31/02 ; G01N21/76 ; G01N29/02 ; G01N29/036 ; G01N33/00

Abstract:
Disclosed is an integrated circuit comprising a substrate (10); and an optical CO2 sensor comprising: first and second light sensors (12, 12′) on said substrate, said second light sensor being spatially separated from the first light sensor; and a layer portion (14) including an organic compound comprising at least one amine or amidine functional group over the first light sensor; wherein said integrated circuit further comprises a signal processor (16) coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor. An electronic device comprising such a sensor and a method of manufacturing such an IC are also disclosed.
Public/Granted literature
- US20140191348A1 INTEGRATED CIRCUIT AND MANUFACTURING METHOD Public/Granted day:2014-07-10
Information query
IPC分类: