发明授权
- 专利标题： Method of fabricating electronic circuit
- 专利标题（中）： 制造电子电路的方法
-
申请号： US14259042申请日： 2014-04-22
-
公开(公告)号： US09177821B2公开(公告)日： 2015-11-03
- 发明人: Soon-Won Jung , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Chul Lim , Sang Seok Lee , Kyoung Ik Cho , Hye Yong Chu
- 申请人： Electronics and Telecommunications Research Institute
- 申请人地址： KR Daejeon
- 专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址： KR Daejeon
- 优先权： KR10-2013-0144635 20131126
- 主分类号： H01L21/338
- IPC分类号： H01L21/338 ; H01L21/311 ; H01L29/66
摘要：
Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.
公开/授权文献
- US20150147854A1 METHOD OF FABRICATING ELECTRONIC CIRCUIT 公开/授权日：2015-05-28
信息查询
IPC分类:
