Invention Grant
- Patent Title: Integrated circuit systems including vertical inductors
- Patent Title (中): 集成电路系统包括垂直电感
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Application No.: US13194695Application Date: 2011-07-29
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Publication No.: US09159711B2Publication Date: 2015-10-13
- Inventor: Rasit O. Topaloglu
- Applicant: Rasit O. Topaloglu
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01F5/00 ; H01F27/28 ; H01L25/16 ; H01L23/66

Abstract:
An integrated circuit system is provided that includes a circuit function in and on a surface of a semiconductor substrate. First and second portions of an inductor overlie the surface of the semiconductor substrate and each is coupled to the first circuit function. A third portion of the inductor is positioned on a second substrate. A first through substrate via (TSV) extends through the semiconductor substrate and electrically couples the first portion to the third portion and a second TSV extends through the semiconductor substrate and electrically couples the second portion to the third portion.
Public/Granted literature
- US20130027127A1 INTEGRATED CIRCUIT SYSTEMS INCLUDING VERTICAL INDUCTORS Public/Granted day:2013-01-31
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