An integrated circuit system is provided that includes a circuit function in and on a surface of a semiconductor substrate. First and second portions of an inductor overlie the surface of the semiconductor substrate and each is coupled to the first circuit function. A third portion of the inductor is positioned on a second substrate. A first through substrate via (TSV) extends through the semiconductor substrate and electrically couples the first portion to the third portion and a second TSV extends through the semiconductor substrate and electrically couples the second portion to the third portion.