Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14584793Application Date: 2014-12-29
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Publication No.: US09153576B2Publication Date: 2015-10-06
- Inventor: Hiroshi Hosokawa , Yusuke Yamashita , Satoru Machida
- Applicant: Hiroshi Hosokawa , Yusuke Yamashita , Satoru Machida
- Applicant Address: JP Toyota
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- Priority: JP2014-012505 20140127
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/739
![Semiconductor device](/abs-image/US/2015/10/06/US09153576B2/abs.jpg.150x150.jpg)
Abstract:
A semiconductor substrate comprises an IGBT region and a diode region. The IGBT region comprises: an n-type emitter region; a p-type IGBT body region; an n-type IGBT barrier region; an n-type IGBT drift region; a p-type collector region; a first trench; a first insulating layer; and a first gate electrode. The diode region comprises: a p-type diode top body region; an n-type diode barrier region; a p-type diode bottom body region; an n-type cathode region; a second trench; a second insulating layer; and a second gate electrode. An n-type impurity density of a specific part of the diode barrier region making contact with the second insulating layer is higher than an n-type impurity density of the IGBT barrier region.
Public/Granted literature
- US20150214217A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-07-30
Information query
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