Invention Grant
- Patent Title: MEMS devices and methods of fabrication thereof
- Patent Title (中): MEMS器件及其制造方法
-
Application No.: US12683550Application Date: 2010-01-07
-
Publication No.: US09138994B2Publication Date: 2015-09-22
- Inventor: Jung-Huei Peng , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Ting-Hau Wu
- Applicant: Jung-Huei Peng , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Ting-Hau Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16

Abstract:
MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.
Public/Granted literature
- US20100225708A1 MEMS Devices and Methods of Fabrication Thereof Public/Granted day:2010-09-09
Information query
IPC分类: