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US09130123B2 Light emitting device and light emitting device package 有权
发光器件和发光器件封装

Light emitting device and light emitting device package
摘要：
A light emitting device and a light emitting device package including the same are provided. The light emitting device may include a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode on the light emitting structure, the first electrode including a pattern, and a pad electrode on the first electrode.
摘要（中）：

提供一种发光器件和包括该发光器件的发光器件封装。 发光器件可以包括发光结构，其包括第一导电类型半导体层，有源层和第二导电类型半导体层，发光结构上的第一电极，包括图案的第一电极和焊盘电极 在第一个电极上。

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