发明授权
- 专利标题: Three-dimensional semiconductor memory device, memory system including the same, method of manufacturing the same and method of operating the same
- 专利标题(中): 三维半导体存储器件,包括其的存储器系统,其制造方法及其操作方法
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申请号: US13718905申请日: 2012-12-18
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公开(公告)号: US09130038B2公开(公告)日: 2015-09-08
- 发明人: Sa Yong Shim , Kyoung Jin Park
- 申请人: SK hynix Inc.
- 申请人地址: KR Gyeonggi-do
- 专利权人: SK Hynix Inc.
- 当前专利权人: SK Hynix Inc.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: William Park & Associates Ltd.
- 优先权: KR10-2012-0096481 20120831
- 主分类号: G11C11/34
- IPC分类号: G11C11/34 ; H01L29/78 ; G11C16/04 ; H01L29/66 ; G11C16/10 ; H01L29/792 ; H01L27/115
摘要:
A semiconductor memory device, a memory system including the same, a method of manufacturing the same and a method of operating the same are provided. The semiconductor memory device includes a pipe channel layer, vertical channel layers coupled to a top surface of the pipe channel layer, a first pipe gate substantially surrounding a bottom surface and side surfaces of the pipe channel layer, a boosting gate formed over the pipe channel layer, and first insulating layers and conductive layers alternately stacked over the boosting gate and the pipe channel layer.
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