A method of fabricating an integrated circuit package assembly comprises forming solder bumps over a first surface of a first integrated circuit package. The method also comprises forming at least one first support structure over the first surface of the first integrated circuit package or over a second surface of a second integrated circuit package. The method further comprises mounting the first integrated circuit package over a second integrated circuit package. The first integrated circuit package is mounted over the second integrated circuit package with the first surface facing the second surface, and the at least one first support structure is electrically isolated.