A processing apparatus of the present invention processes for a wafer. The processing apparatus includes an XY stage which includes a wafer chuck which holds the wafer and an elevating device which rises relative to the wafer chuck to hold the wafer, and a wafer conveying robot hand which conveys the wafer from the XY stage at a wafer transfer position. The XY stage moves to change a direction at an angle between degree and degree via the wafer transfer position in a state where the elevating device rises relative to the wafer chuck. The wafer conveying robot hand has a shape which does not interfere with the XY stage which moves to change the direction at the angle when the wafer conveying hand is positioned at the wafer transfer position.