发明授权
- 专利标题： Bonding structure manufacturing method, heating and melting treatment method, and system therefor
- 专利标题（中）： 粘结结构制造方法，加热熔融处理方法及其系统
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申请号： US14275153申请日： 2014-05-12
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公开(公告)号： US09119336B2公开(公告)日： 2015-08-25
- 发明人: Hideyuki Abe , Kazuaki Mawatari
- 申请人： Hideyuki Abe , Kazuaki Mawatari
- 申请人地址： JP Himeji-Shi, Hyogo
- 专利权人： AYUMI INDUSTRY CO., LTD.
- 当前专利权人： AYUMI INDUSTRY CO., LTD.
- 当前专利权人地址： JP Himeji-Shi, Hyogo
- 代理机构： Porzio, Bromberg & Newman, P.C.
- 优先权： JP2010-146337 20100628; JP2010-166448 20100723
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; H05K13/04 ; B23K1/20 ; B23K1/00 ; B23K1/008 ; H01L23/00
摘要：
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
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