Invention Grant
- Patent Title: Low application temperature hot melt adhesive
- Patent Title (中): 低应用温度热熔胶
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Application No.: US14188167Application Date: 2014-02-24
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Publication No.: US09115299B2Publication Date: 2015-08-25
- Inventor: Yuhong Hu , Maria Xenidou , Alethea Pollock-Downer , Matthew Sharak , Maria Cristina Barbosa Dejesus
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Lee Lehmann
- Main IPC: C09J153/00
- IPC: C09J153/00 ; B32B37/12 ; C09J123/02 ; B32B27/00 ; C09J5/00 ; C09J123/14 ; C09J123/20
Abstract:
The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
Public/Granted literature
- US20140171586A1 LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE Public/Granted day:2014-06-19
Information query
IPC分类:
