发明授权
- 专利标题： Package systems and manufacturing methods thereof
- 专利标题（中）： 包装系统及其制造方法
-
申请号： US14173406申请日： 2014-02-05
-
公开(公告)号： US09112001B2公开(公告)日： 2015-08-18
- 发明人: Chia-Pao Shu , Chun-wen Cheng , Kuei-Sung Chang , Hsin-Ting Huang , Shang-Ying Tsai , Jung-Huei Peng
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/768 ; B81C1/00 ; H01L23/00 ; H01L25/065
摘要：
A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.
公开/授权文献
- US20140170849A1 PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF 公开/授权日：2014-06-19
信息查询
IPC分类:
