Invention Grant
- Patent Title: External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the same
- Patent Title (中): 外部连接端子，具有外部连接端子的半导体封装及其制造方法
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Application No.: US14142719Application Date: 2013-12-27
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Publication No.: US09105616B2Publication Date: 2015-08-11
- Inventor: Chang Seob Hong , Eun Jung Jo , Kyu Hwan Oh , Kang Hyun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2013-0115581 20130927
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/482 ; H01L23/00
Abstract:
Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material.
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