A through-hole depth measurement device includes a cutting force sensor configured and mountable in a position to sense cutting force exerted by a drill bit of a drill against a workpiece or stack of workpieces. A controller is coupled to the force sensor, is coupleable to a workpiece surface position sensor, and is configured to record the through-hole depth of the workpiece or stack of workpieces in response to signals received from the workpiece surface position sensor when the drill bit reaches a drill bit exit point. The cutting force sensor is configured and positionable to sense cutting force transmitted between a drill spindle and a spindle housing.