Invention Grant
US09099453B2 Methods, circuits and systems for a package structure having wireless lateral connections
有权
用于具有无线横向连接的封装结构的方法，电路和系统
- Patent Title: Methods, circuits and systems for a package structure having wireless lateral connections
- Patent Title (中): 用于具有无线横向连接的封装结构的方法，电路和系统
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Application No.: US13919536Application Date: 2013-06-17
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Publication No.: US09099453B2Publication Date: 2015-08-04
- Inventor: Federico Giovanni Ziglioli , Alberto Pagani
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Group PLLC
- Priority: ITVI2012A0145 20120615
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/50 ; H01L23/495 ; H01L23/498 ; H01L25/10 ; H01L23/538 ; H01L23/31 ; H01L21/56 ; H01L23/00
Abstract:
A packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor.
Public/Granted literature
- US20130334675A1 PACKAGE STRUCTURE HAVING LATERAL CONNECTIONS Public/Granted day:2013-12-19
Information query
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