Invention Grant
- Patent Title: Ultrasonic transducer and method of manufacturing the same
- Patent Title (中): 超声波换能器及其制造方法
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Application No.: US13960874Application Date: 2013-08-07
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Publication No.: US09090458B2Publication Date: 2015-07-28
- Inventor: Seog-woo Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0136553 20121128
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; B06B1/02 ; G01N29/24

Abstract:
An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a metal and which fills the via hole, a second electrode which is provided on a bottom of the conductive substrate, a membrane which is provided on the projection and which covers the cavity, and an upper electrode which is provided on the membrane and which contacts the first electrode.
Public/Granted literature
- US20140145275A1 ULTRASONIC TRANSDUCER AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-05-29
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