Invention Grant
- Patent Title: Substrate of semiconductor package and method of fabricating semiconductor package using the same
- Patent Title (中): 半导体封装的基板和使用其制造半导体封装的方法
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Application No.: US14619155Application Date: 2015-02-11
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Publication No.: US09082871B2Publication Date: 2015-07-14
- Inventor: Gi-Jun Park , Won-Keun Kim , Teak-Hoon Lee , Chang-Seong Jeon , Young-Kun Jee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Ellsworth IP Group PLLC
- Priority: KR10-2012-0074542 20120709
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/498 ; H01L21/673 ; H01L23/48 ; H01L21/50
Abstract:
A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
Public/Granted literature
- US20150155259A1 SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2015-06-04
Information query
IPC分类:
