Invention Grant
- Patent Title: Imprinted multi-layer micro-structure
- Patent Title (中): 印刷多层微结构
-
Application No.: US14012195Application Date: 2013-08-28
-
Publication No.: US09078360B2Publication Date: 2015-07-07
- Inventor: Ronald Steven Cok
- Applicant: Ronald Steven Cok
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/00 ; H05K1/02 ; H05K3/46 ; H05K3/12 ; H05K3/00

Abstract:
An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.
Public/Granted literature
- US20150060111A1 IMPRINTED MULTI-LAYER MICRO-STRUCTURE Public/Granted day:2015-03-05
Information query