发明授权
- 专利标题： Three-dimensional structure in which wiring is provided on its surface
- 专利标题（中）： 在其表面上设置布线的三维结构
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申请号： US14196363申请日： 2014-03-04
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公开(公告)号： US09070393B2公开(公告)日： 2015-06-30
- 发明人: Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
- 申请人： PANASONIC CORPORATION
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： JP2009-015052 20090127; JP2009-253131 20091104
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; G11B5/48 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H05K1/11 ; H05K1/18 ; H05K3/18 ; H01L23/498 ; H01L21/48 ; H01L21/66 ; H01L23/31 ; H01L21/56 ; H01L23/14
摘要：
One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.
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