Invention Grant
- Patent Title: Soft magnetic under layer
- Patent Title (中): 软磁下层
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Application No.: US13816789Application Date: 2012-07-05
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Publication No.: US09064519B2Publication Date: 2015-06-23
- Inventor: Jun Fukuoka , Kazuya Saitoh
- Applicant: Jun Fukuoka , Kazuya Saitoh
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-149879 20110706
- International Application: PCT/JP2012/067150 WO 20120705
- International Announcement: WO2013/005785 WO 20130110
- Main IPC: G11B5/667
- IPC: G11B5/667 ; H01F10/32

Abstract:
A soft magnetic under layer has a low antiferromagnetic coupling force and a high saturation magnetic flux density. The soft magnetic under layer includes two soft magnetic layers and a spacer layer. The soft magnetic layers are expressed by a composition formula as (Fe100-XCoX)100-Y-MY by atomic ratio, wherein 15≦X≦30, 10≦Y≦30, and an element M is at least one element selected from a group of Ta, Ti, Zr, Nb, Cr, and B; are composed of residual incidental impurities; and each have a thickness of 10 to 50 nm. The spacer layer is composed of one element selected from a group of Ru, Cr, Cu, Re, and Rh and has a thickness of 0.10 to 0.50 nm. The soft magnetic layers are antiferromagnetically coupled through the spacer layer inserted therebetween. An antiferromagnetic coupling force between the soft magnetic layers is 100 to 4,000 A/m.
Public/Granted literature
- US20130143072A1 Soft Magnetic Under Layer Public/Granted day:2013-06-06
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