Invention Grant
- Patent Title: Multilayer capacitor and method for manufacturing the same
- Patent Title (中): 多层电容器及其制造方法
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Application No.: US13476485Application Date: 2012-05-21
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Publication No.: US09053864B2Publication Date: 2015-06-09
- Inventor: Masaaki Togashi
- Applicant: Masaaki Togashi
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-117355 20110525
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G4/12 ; H01G4/232

Abstract:
In a multilayer capacitor, a first dielectric layered product including a first body principal face is formed to be thicker than a second dielectric layered product including a second body principal face in a stacking direction thereof. A first external electrode and a second external electrode extend only to the first body principal face from a first body end face and a second body end face. Alternatively, the first external electrode and the second external electrode extend at least to the first body principal face from the first body end face and the second body end face and extend also to at least one of the second body principal face, a first body lateral face, and a second body lateral face.
Public/Granted literature
- US20120300361A1 MULTILAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-11-29
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