发明授权
- 专利标题： Electroformed housings for electronic devices
- 专利标题（中）： 用于电子设备的电铸外壳
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申请号： US13708683申请日： 2012-12-07
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公开(公告)号： US09031276B2公开(公告)日： 2015-05-12
- 发明人: Peter N. Russell-Clarke
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Van Court & Aldridge LLP
- 主分类号： H04R25/00
- IPC分类号： H04R25/00 ; H04R1/10 ; H04R31/00 ; C25D1/02 ; C25D1/20 ; H04R1/02
摘要：
Electroformed housings for electronic devices and methods for making the same are provided. An electronic device is provided having at least one electronic part and an electroformed housing constructed from a metal that encloses the at least one electronic part.
公开/授权文献
- US20140161298A1 ELECTROFORMED HOUSINGS AND METHODS FOR MAKING THE SAME 公开/授权日：2014-06-12
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