Methods and systems for electrically coupling bonded components, including: a support layer, an electrically conductive wire supported by the support layer, and an electrically conductive adhesive, the electrically conductive adhesive being over the electrically conductive wire, the electrically conductive adhesive being electrically coupled to the electrically conductive wire, the electrically conductive adhesive extending beyond the electrically conductive wire onto the support layer, the electrically conductive adhesive being configured to adhesively bond to the support layer, the electrically conductive adhesive being configured to adhesively bond to one or more additional components above the electrically conductive adhesive, the electrically conductive wire being configured to be electrically coupled to the one or more additional components through the electrically conductive adhesive.