Invention Grant
- Patent Title: Package for semiconductor device including guide rings and manufacturing method of the same
- Patent Title (中): 包括引导环的半导体器件的封装及其制造方法
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Application No.: US14064467Application Date: 2013-10-28
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Publication No.: US09018041B2Publication Date: 2015-04-28
- Inventor: Han-shin Youn , Yonghwan Kwon , YoungHoon Ro , Woojae Kim , Sungwoo Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0094617 20100929
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L23/00 ; H01L23/498 ; H01L25/10 ; H01L25/16 ; H01L21/56
Abstract:
An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.
Public/Granted literature
- US20140051243A1 PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2014-02-20
Information query
IPC分类:
