Invention Grant
- Patent Title: Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board
- Patent Title (中): 制造陶瓷电子部件，陶瓷电子部件和配线基板的方法
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Application No.: US14339506Application Date: 2014-07-24
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Publication No.: US09007161B2Publication Date: 2015-04-14
- Inventor: Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-164112 20100721
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01C1/14 ; H01C7/00 ; H01C7/02 ; H01G2/06 ; H01G4/228 ; H01F27/28 ; H01G4/008 ; H01G4/12 ; H01L41/083 ; H05K3/32
Abstract:
A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
Public/Granted literature
- US20140332260A1 METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD Public/Granted day:2014-11-13
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