发明授权
US09005485B2 High performance die attach adhesives (DAAs) nanomaterials for high brightness LED
有权
用于高亮度LED的高性能贴片粘合剂（DAAs）纳米材料
- 专利标题： High performance die attach adhesives (DAAs) nanomaterials for high brightness LED
- 专利标题（中）： 用于高亮度LED的高性能贴片粘合剂（DAAs）纳米材料
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申请号： US13821566申请日： 2012-03-22
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公开(公告)号： US09005485B2公开(公告)日： 2015-04-14
- 发明人: Chenmin Liu , Dong Lu , Xianxin Lang , Bo Wang , Zhiying Li
- 申请人： Chenmin Liu , Dong Lu , Xianxin Lang , Bo Wang , Zhiying Li
- 申请人地址： HK The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon
- 专利权人： Nano and Advanced Materials Institute Limited
- 当前专利权人： Nano and Advanced Materials Institute Limited
- 当前专利权人地址： HK The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon
- 代理机构： Ella Cheong Hong Kong
- 代理商 Sam T. Yip
- 国际申请： PCT/CN2012/072843 WO 20120322
- 国际公布： WO2012/126391 WO 20120927
- 主分类号： H01B1/22
- IPC分类号： H01B1/22 ; C09J9/02 ; C08G59/40 ; C08G59/68 ; C09J163/00 ; C08K3/08
摘要：
The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.
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