The invention relates to a polyethylene molding composition which has a multimodal molecular mass distribution and comprises a low molecular weight ethylene homopolymer A, a high molecular weight ethylene copolymer B and an ultrahigh molecular weight ethylene copolymer C. The molding composition has a density at a temperature of 23° C. in the range from 0.940 to 0.957 g/cm3, an MFR (190° C./2.16 kg) in the range from 0.5 to 4 dg/min and a viscosity number VN3 of the mixture of ethylene homopolymer A, copolymer B and ethylene copolymer C, measured in accordance with ISO/R 1191 in decalin at a temperature of 135° C., in the range from 150 to 300 cm3/g. The invention further relates to the use of such a molding composition for producing injection-molded finished parts, and to finished parts produced by injection molding.