Invention Grant
- Patent Title: Method for providing electrical connections to spaced conductive lines
- Patent Title (中): 为间隔导线提供电气连接的方法
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Application No.: US14258476Application Date: 2014-04-22
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Publication No.: US08987906B2Publication Date: 2015-03-24
- Inventor: Gurtej Sandhu , Scott Sills
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dickstein Shapiro LLP
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/3213 ; H01L21/768 ; H01L27/108 ; H01L21/308 ; H01L21/28 ; H01L21/285 ; H01L21/8238

Abstract:
An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.
Public/Granted literature
- US20140225264A1 METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES Public/Granted day:2014-08-14
Information query
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