Invention Grant
- Patent Title: Thin film transistor and fabricating method
- Patent Title (中): 薄膜晶体管及其制造方法
-
Application No.: US14107742Application Date: 2013-12-16
-
Publication No.: US08987071B2Publication Date: 2015-03-24
- Inventor: Min-Cheng Chen , Chang-Hsien Lin , Chia-Yi Lin , Tung-Yen Lai , Chia-Hua Ho
- Applicant: National Applied Research Laboratories
- Applicant Address: TW Taipei
- Assignee: National Applied Research Laboratories
- Current Assignee: National Applied Research Laboratories
- Current Assignee Address: TW Taipei
- Agency: Ditthavong & Steiner, P.C.
- Priority: TW100147632A 20111221
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/06 ; B82Y10/00 ; H01L27/06 ; H01L21/84 ; H01L21/8238 ; H01L27/092

Abstract:
A thin-film transistor comprises a semiconductor panel, a dielectric layer, a semiconductor film layer, a conduct layer, a source and a drain. The semiconductor panel comprises a base, an intra-dielectric layer, at least one metal wire layer and at least one via layer. The dielectric layer is stacked on the semiconductor panel. The semiconductor film layer is stacked on the dielectric layer. The conduct layer is formed on the semiconductor film layer. The source is formed on the via of the vias that is adjacent to and connects to the gate via. The drain is formed on another via of the vias that is adjacent to and connects to the gate via. A fabricating method for a thin-film transistor with metal-gates and nano-wires is also disclosed.
Public/Granted literature
- US20140099756A1 THIN FILM TRANSISTOR AND FABRICATING METHOD Public/Granted day:2014-04-10
Information query
IPC分类: