Invention Grant
- Patent Title: Method of forming patterns
- Patent Title (中): 形成图案的方法
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Application No.: US13719995Application Date: 2012-12-19
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Publication No.: US08986554B2Publication Date: 2015-03-24
- Inventor: Eun-sung Kim , Kyoung-seon Kim , Jae-woo Nam , Chul-ho Shin , Shi-young Yi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0048321 20120507
- Main IPC: H01B13/00
- IPC: H01B13/00 ; H01L21/308 ; G03F1/00 ; H01L21/027 ; H01L21/033
Abstract:
A method of forming patterns includes forming a photoresist film on a substrate. The photoresist film is exposed with a first dose of light to form a first area and a second area in the photoresist film. A first hole and a second hole are formed by removing the first area and the second area with a first developer. The photoresist film is re-exposed with a second dose of the light to form a third area in the photoresist film between the first hole and the second hole. A third hole is formed between the first hole and the second hole by removing the third area with a second developer.
Public/Granted literature
- US20130295772A1 METHOD OF FORMING PATTERNS Public/Granted day:2013-11-07
Information query
