A position measuring apparatus with at least one material measure comprised of an optical structure of an arrangement of 3-D reflectors, at least one light receiver arranged at a distance from the material measure, a light source arranged at a distance from the material measure and at a distance from the light receiver, and at least one transparent substrate present between the material measure and the light receiver, wherein the light receiver is deposited directly on the transparent substrate, on the side of the substrate opposite the material measure in the form of a thin-film structure consisting of several layers arranged one above another. A supporting plate is provided with circuit-board conductors, on which the substrate is arranged, wherein the transparent substrate and the supporting plate are joined solidly together by a Flip-Chip assembly process.