发明授权
US08982169B2 Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern
有权
精细的布线图案及其组成,制造方法和包括精细布线图案的热打印头
- 专利标题: Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern
- 专利标题(中): 精细的布线图案及其组成,制造方法和包括精细布线图案的热打印头
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申请号: US13747703申请日: 2013-01-23
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公开(公告)号: US08982169B2公开(公告)日: 2015-03-17
- 发明人: Shinobu Obata , Koji Nishi , Takafumi Katsuno , Masumi Okumura , Nobuhito Kinoshita
- 申请人: Rohm Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Rohm Co., Ltd.
- 当前专利权人: Rohm Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: JP2012-12936 20120125; JP2012-120888 20120528
- 主分类号: B41J2/335
- IPC分类号: B41J2/335 ; B41J2/045 ; H05K3/06 ; H05K1/09 ; H05K3/12 ; H05K1/03
摘要:
According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
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