Invention Grant
US08981559B2 Package on package devices and methods of packaging semiconductor dies
有权
封装器件封装以及封装半导体管芯的方法
- Patent Title: Package on package devices and methods of packaging semiconductor dies
- Patent Title (中): 封装器件封装以及封装半导体管芯的方法
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Application No.: US13532402Application Date: 2012-06-25
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Publication No.: US08981559B2Publication Date: 2015-03-17
- Inventor: Chun-Lei Hsu , Chung-Shi Liu , De-Yuan Lu , Ming-Che Ho , Yu-Feng Chen
- Applicant: Chun-Lei Hsu , Chung-Shi Liu , De-Yuan Lu , Ming-Che Ho , Yu-Feng Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/48 ; H01L23/31 ; H01L23/498 ; H01L25/10 ; H01L25/00 ; H01L23/00
Abstract:
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.
Public/Granted literature
- US20130341786A1 Package on Package Devices and Methods of Packaging Semiconductor Dies Public/Granted day:2013-12-26
Information query
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