Invention Grant
- Patent Title: Power semiconductor device and method of fabricating the same
- Patent Title (中): 功率半导体器件及其制造方法
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Application No.: US13937589Application Date: 2013-07-09
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Publication No.: US08981423B2Publication Date: 2015-03-17
- Inventor: Dong Soo Seo , Jaehoon Park , Kee Ju Um , Chang Su Jang , In Hyuk Song
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0034668 20130329
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739

Abstract:
There is provided a power semiconductor device, including a plurality of trench gates formed to be spaced apart from each other by a predetermined distance, a current increasing part formed between the trench gates and including a first conductivity-type emitter layer and a gate oxide formed on a surface of the trench gate, and an immunity improving part formed between the trench gates and including a second conductivity-type body layer, a preventing film formed on the surface of the trench gate, and a gate oxide having a thickness less than that the gate oxide of the current increasing part.
Public/Granted literature
- US20140291722A1 POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-10-02
Information query
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