发明授权
- 专利标题: Structure and method for a SRAM circuit
- 专利标题(中): SRAM电路的结构和方法
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申请号: US13414323申请日: 2012-03-07
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公开(公告)号: US08964455B2公开(公告)日: 2015-02-24
- 发明人: Jhon Jhy Liaw
- 申请人: Jhon Jhy Liaw
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: G11C11/00
- IPC分类号: G11C11/00
摘要:
The present disclosure provides an integrated circuit formed in a semiconductor substrate. The integrated circuit includes a first static random access memory (SRAM) cell having a first cell size; and a second SRAM cell having a second cell size greater than the first cell size. The first SRAM cell includes first n-type field effect transistors (nFETs) each having a first gate stack. The second SRAM cell includes second nFETs each having a second gate stack different from the first gate stack.
公开/授权文献
- US20130235652A1 STRUCTURE AND METHOD FOR A SRAM CIRCUIT 公开/授权日:2013-09-12
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