发明授权
- 专利标题: Boosting circuit
- 专利标题(中): 升压电路
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申请号: US13966023申请日: 2013-08-13
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公开(公告)号: US08963624B2公开(公告)日: 2015-02-24
- 发明人: Hiroki Murakami
- 申请人: Winbond Electronics Corp.
- 申请人地址: TW Taichung
- 专利权人: Windbond Electronics Corp.
- 当前专利权人: Windbond Electronics Corp.
- 当前专利权人地址: TW Taichung
- 代理机构: Muncy, Geissler, Olds & Lowe, P.C.
- 优先权: JP2011-141328 20110627
- 主分类号: G11C7/12
- IPC分类号: G11C7/12 ; G05F1/46 ; H02M3/07
摘要:
A boosting circuit, includes an output circuit including a first transmission circuit, transmitting charges of a first boosting node to a first output node according to a first transmission control signal, a detection circuit, detecting the voltage level of the first output node, and a pre-charge circuit pre-charging the first boosting node according a detection signal of the detection circuit; a first pump circuit includes a second transmission circuit, transmitting charges to a second output node according to a second transmission control signal, and a first capacitance unit, coupled to the first boosting node, boosting the voltage level of the first boosting node according to charges transmitted in the second output node; and a control circuit, coupled to the output circuit and the first pump circuit, controls the second transmission control signal according to the voltage level of the first output node.
公开/授权文献
- US20140035663A1 Boosting Circuit 公开/授权日:2014-02-06
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