发明授权
- 专利标题： Thermal annealing process
- 专利标题（中）： 热退火工艺
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申请号： US13370907申请日： 2012-02-10
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公开(公告)号： US08961918B2公开(公告)日： 2015-02-24
- 发明人: Shih-Wei Chang , Jeffrey D. Weinhold , Phillip D. Hustad , Peter Trefonas
- 申请人： Shih-Wei Chang , Jeffrey D. Weinhold , Phillip D. Hustad , Peter Trefonas
- 申请人地址： US MA Marlborough US MI Midland
- 专利权人： Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- 当前专利权人地址： US MA Marlborough US MI Midland
- 代理商 Thomas S. Deibert
- 主分类号： C01B15/14
- IPC分类号： C01B15/14 ; C01B33/20 ; B05D3/02 ; B05D3/04
摘要：
A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(dimethylsiloxane) block copolymer component to a surface of the substrate; optionally, baking the film; subjecting the film to a high temperature annealing process under particularized atmospheric conditions for a specified period of time; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(dimethylsiloxane) in the annealed film to SiOx.
公开/授权文献
- US20130209344A1 Thermal annealing process 公开/授权日：2013-08-15
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