A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as “d,” and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as “t,” then d>t/tan 35° and preferably d>t/tan 25° is fulfilled.