Invention Grant
US08946834B2 High thermal stability free layer with high out-of-plane anisotropy for magnetic device applications
有权
用于磁性器件应用的具有高的面外各向异性的高热稳定性自由层
- Patent Title: High thermal stability free layer with high out-of-plane anisotropy for magnetic device applications
- Patent Title (中): 用于磁性器件应用的具有高的面外各向异性的高热稳定性自由层
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Application No.: US13409456Application Date: 2012-03-01
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Publication No.: US08946834B2Publication Date: 2015-02-03
- Inventor: Yu-Jen Wang , Witold Kula , Guenole Jan
- Applicant: Yu-Jen Wang , Witold Kula , Guenole Jan
- Applicant Address: US CA Milpitas
- Assignee: Headway Technologies, Inc.
- Current Assignee: Headway Technologies, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: G11C11/14
- IPC: G11C11/14 ; H01L43/08 ; G11C11/02 ; H01F10/32 ; G01R33/09

Abstract:
A CoFeB or CoFeNiB magnetic layer wherein the boron content is 25 to 40 atomic % and with a thickness
Public/Granted literature
- US20130230741A1 High Thermal Stability Free Layer with High Out-of-Plane Anisotropy for Magnetic Device Applications Public/Granted day:2013-09-05
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