Invention Grant
US08939765B2 Reduction of defect rates in PFET transistors comprising a Si/Ge semiconductor material formed by epitaxial growth
有权
包括通过外延生长形成的Si / Ge半导体材料的PFET晶体管中的缺陷率的降低
- Patent Title: Reduction of defect rates in PFET transistors comprising a Si/Ge semiconductor material formed by epitaxial growth
- Patent Title (中): 包括通过外延生长形成的Si / Ge半导体材料的PFET晶体管中的缺陷率的降低
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Application No.: US12965118Application Date: 2010-12-10
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Publication No.: US08939765B2Publication Date: 2015-01-27
- Inventor: Stephan Kronholz , Peter Javorka , Maciej Wiatr , Roman Boschke , Christian Krueger
- Applicant: Stephan Kronholz , Peter Javorka , Maciej Wiatr , Roman Boschke , Christian Krueger
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Priority: DE102010029531 20100531
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8238 ; H01L29/78

Abstract:
In sophisticated semiconductor devices, the defect rate that may typically be associated with the provision of a silicon/germanium material in the active region of P-channel transistors may be significantly decreased by incorporating a carbon species prior to or during the selective epitaxial growth of the silicon/germanium material. In some embodiments, the carbon species may be incorporated during the selective growth process, while in other cases an ion implantation process may be used. In this case, superior strain conditions may also be obtained in N-channel transistors.
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