发明授权
US08912573B2 Semiconductor device containing HEMT and MISFET and method of forming the same
有权
包含HEMT和MISFET的半导体器件及其形成方法
- 专利标题: Semiconductor device containing HEMT and MISFET and method of forming the same
- 专利标题(中): 包含HEMT和MISFET的半导体器件及其形成方法
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申请号: US13777701申请日: 2013-02-26
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公开(公告)号: US08912573B2公开(公告)日: 2014-12-16
- 发明人: Chung-Yen Chou , Sheng-De Liu , Fu-Chih Yang , Shih-Chang Liu , Chia-Shiung Tsai
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/778 ; H01L21/338
摘要:
A semiconductor structure with a MISFET and a HEMT region includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A third III-V compound layer is disposed on the second III-V compound layer is different from the second III-V compound layer in composition. A source feature and a drain feature are disposed in each of the MISFET and HEMT regions on the third III-V compound layer. A gate electrode is disposed over the second III-V compound layer between the source feature and the drain feature. A gate dielectric layer is disposed under the gate electrode in the MISFET region but above the top surface of the third III-V compound layer.
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