发明授权
- 专利标题: Dislocations in SiC semiconductor substrate
- 专利标题(中): SiC半导体衬底中的位错
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申请号: US13664636申请日: 2012-10-31
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公开(公告)号: US08912550B2公开(公告)日: 2014-12-16
- 发明人: Taro Nishiguchi , Shin Harada , Shinsuke Fujiwara
- 申请人: Sumitomo Electric Industries, Ltd.
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2011-280863 20111222; JP2011-280864 20111222; JP2011-280865 20111222
- 主分类号: H01L29/15
- IPC分类号: H01L29/15 ; H01L31/0312
摘要:
A semiconductor substrate has a main surface and formed of single crystal silicon carbide. The main surface includes a central area, which is an area other than the area within 5 mm from the outer circumference. When the central area is divided into square areas of 1 mm×1 mm, in any square area, density of dislocations of which Burgers vector is parallel to direction is at most 1×105 cm−2. Thus, a silicon carbide semiconductor substrate enabling improved yield of semiconductor devices can be provided.
公开/授权文献
- US20130161646A1 SEMICONDUCTOR SUBSTRATE 公开/授权日:2013-06-27
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