发明授权
- 专利标题： Unit for semiconductor device and semiconductor device
- 专利标题（中）： 半导体器件和半导体器件单元
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申请号： US13500034申请日： 2010-12-28
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公开(公告)号： US08907477B2公开(公告)日： 2014-12-09
- 发明人: Takafumi Yamada , Tetsuya Inaba , Yoshinari Ikeda , Katsuhiko Yanagawa , Yoshikazu Takahashi
- 申请人： Takafumi Yamada , Tetsuya Inaba , Yoshinari Ikeda , Katsuhiko Yanagawa , Yoshikazu Takahashi
- 申请人地址： JP Kawasaki-Shi
- 专利权人： Fuji Electric Co., Ltd.
- 当前专利权人： Fuji Electric Co., Ltd.
- 当前专利权人地址： JP Kawasaki-Shi
- 代理商 Manabu Kanesaka
- 优先权： JP2010-000470 20100105
- 国际申请： PCT/JP2010/073795 WO 20101228
- 国际公布： WO2011/083737 WO 20110714
- 主分类号： H01L23/433
- IPC分类号： H01L23/433 ; H01L23/498 ; H01L25/18 ; H01L25/11 ; H01L23/40 ; H01L23/31
摘要：
A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit (101) includes copper blocks (1, 8), an insulating substrate (6) with a conductive pattern, an IGBT chip (10), a diode chip (13), a collector terminal pin (15), implant pins (17) fixed to the chips (10) by solder (11), a printed circuit board (16) having the implant pins (17) fixed thereto, an emitter terminal pin (19), a control terminal pin (20), a collector terminal pin (15), and a resin case (21) having the above-mentioned components sealed therein. The copper blocks (1, 8) make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units (101) can be combined with an inter-unit wiring board to form any circuit.
公开/授权文献
- US20120241953A1 UNIT FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 公开/授权日：2012-09-27
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