发明授权
- 专利标题: Acoustic wave device and module including a dielectric film with an inclined upper surface
- 专利标题(中): 声波装置和模块包括具有倾斜上表面的电介质膜
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申请号: US13725514申请日: 2012-12-21
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公开(公告)号: US08896399B2公开(公告)日: 2014-11-25
- 发明人: Michio Miura , Satoru Matsuda , Takashi Yamashita , Hiraki Domon
- 申请人: Taiyo Yuden Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Taiyo Yuden Co., Ltd.
- 当前专利权人: Taiyo Yuden Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Chen Yoshimura LLP
- 主分类号: H03H9/64
- IPC分类号: H03H9/64 ; H03H9/25 ; H03H9/02 ; H03H3/08
摘要:
An acoustic wave device includes: a substrate; a dielectric film formed on the substrate; opposing comb-shaped electrodes located between the substrate and the dielectric film, each of the opposing comb-shaped electrodes including an electrode finger, wherein at least one of the substrate and the dielectric film is a piezoelectric substance, an upper surface of the dielectric film, which is located above a gap between a tip of an electrode finger of one of the opposing comb-shaped electrodes and the other of the opposing comb-shaped electrodes, is inclined against an upper surface of the substrate in an extension direction of the electrode finger, and an inclination angle of the upper surface of the dielectric film against the upper surface of the substrate is equal to or larger than 30° and equal to or smaller than 50°.
公开/授权文献
- US20130106536A1 ACOUSTIC WAVE DEVICE AND MODULE 公开/授权日:2013-05-02
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