发明授权
- 专利标题: High frequency probing structure
- 专利标题(中): 高频探测结构
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申请号: US12982541申请日: 2010-12-30
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公开(公告)号: US08878560B2公开(公告)日: 2014-11-04
- 发明人: Ying-Hsin Kuo , Wensen Hung
- 申请人: Ying-Hsin Kuo , Wensen Hung
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: G01R31/00
- IPC分类号: G01R31/00 ; G01R31/28 ; G01R1/073 ; G01R1/067
摘要:
The present disclosure provide a probe card for wafer level testing. The probe card includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes various conductive lines having a first pitch on a first surface and a second pitch on a second surface, the second pitch being substantially less than the first pitch; a printed circuit board configured approximate the first surface of the space transformer; and a power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line of the space transformer to the printed circuit board.
公开/授权文献
- US20120169367A1 HIGH FREQUENCY PROBING STRUCTURE 公开/授权日:2012-07-05
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