发明授权
- 专利标题： Chip package incorporating interfacial adhesion through conductor sputtering
- 专利标题（中）： 通过导体溅射结合界面粘合的芯片封装
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申请号： US13599411申请日： 2012-08-30
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公开(公告)号： US08871634B2公开(公告)日： 2014-10-28
- 发明人: Tao Wu , Islam A. Salama
- 申请人： Tao Wu , Islam A. Salama
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman Lundberg & Woessner
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763 ; H01L21/768 ; H01L23/48
摘要：
This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line.
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