发明授权
- 专利标题： Electromagnetic shield and associated methods
- 专利标题（中）： 电磁屏蔽及相关方法
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申请号： US13159203申请日： 2011-06-13
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公开(公告)号： US08853833B2公开(公告)日： 2014-10-07
- 发明人: Vladimir Mikhalev , Michael Smith , Henry J. Fulford , Puneet Sharma , Zia A. Shafi
- 申请人： Vladimir Mikhalev , Michael Smith , Henry J. Fulford , Puneet Sharma , Zia A. Shafi
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L23/522
摘要：
Semiconductor devices are described, along with methods and systems that include them. One such device includes a diffusion region in a semiconductor material, a terminal coupled to the diffusion region, and a field plate coupled to the terminal and extending from the terminal over the diffusion region to shield the diffusion region. Additional embodiments are also described.
公开/授权文献
- US20120313691A1 ELECTROMAGNETIC SHIELD AND ASSOCIATED METHODS 公开/授权日：2012-12-13
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