发明授权
- 专利标题: Sputtering apparatus
- 专利标题(中): 溅射装置
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申请号: US13938289申请日: 2013-07-10
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公开(公告)号: US08852411B2公开(公告)日: 2014-10-07
- 发明人: Wei-Cheng Ling
- 申请人: Hon Hai Precision Industry Co., Ltd.
- 申请人地址: TW New Taipei
- 专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: TW New Taipei
- 代理机构: Novak Druce Connolly Bove + Quigg LLP
- 优先权: TW99112640A 20100422
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C25B11/00 ; C25B13/00 ; C23C14/56 ; H01J37/34 ; C23C14/50 ; C23C14/02 ; H01L21/67
摘要:
A sputtering apparatus includes a support assembly and posts. The support assembly includes an upper base, a lower base, seat members, and connection posts interconnected between the upper base and the lower base. The upper base defines cutouts. The seat members are rotatably mounted on the lower base and aligned with the cutouts. Each seat member includes a hollow receiving post, a support post moveably received in the receiving post, a lever bar pivotably connected to the receiving post, and a drive post, the drive post and the support post are coupled to opposite ends of the lever bar. Each seat member is rotatable about a longitudinal axis of the receiving post. The posts fix workpieces in place. Each post includes a rod body portion having a first end and an opposite second end, an engagement portion at the first end, and a protrusion extending from the second end.
公开/授权文献
- US20130299348A1 SPUTTERING APPARATUS 公开/授权日:2013-11-14
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